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Weinberger 2008
the 'tree' of knowledge of JJJatbcmatics and reIatcd ficIds docs not grow only by putting forth new bnDdIcs
Das Fragment eröffnet zwei Wege der Analyse
deren Verfügbarkeit für den Anlagenbetreiber vor dem Hintergrund des steigenden Wettbewerbs- und Kostendrucks große Bedeutung erlangt
rechtliche und histortische Einordnung
Electronic Packaging for High Reliability, Low Cost Electronics formatIsbn:Hardcover - 9780792352181 Weinberger 2008Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The
